Zur Startseite des Instituts für Feinwerktechnik und Elektronik-Design

Technische Universität Dresden
Institut für Feinwerktechnik und
Elektronik-Design

 

Startseite

Feinwerktechnik

Elektronik-Design

Dienstleistungen

Forschung

Lehre

Mitarbeiter

Infos

 

Dr.-Ing. Robert Fischbach
Wissenschaftlicher Mitarbeiter		  

 

 

Forschung:
 

3D-Entwurf

Heterogener Systementwurf

Layoutentwurf von Interposer-basierten 3D-Systemen

 

 

 

Veröffentlichungen:

  • A. Krinke, R. Fischbach, J. Lienig: Layout Verification Using Open-Source Software. Proc. of the ACM 2024 Int. Symposium on Physical Design (ISPD'24), DOI: 10.1145/3626184.3635289, Taipei, Taiwan, pp.. 137-142, March 2024. (PDF, ACM)

  • A. Hirler, U. Abelein, M. Büttner, R. Fischbach, G. Jerke, A. Krinke, S. Simon: Mission Profile Clustering Using a Universal Quantile Criterion. IEEE International Reliability Physics Symposium (IRPS 2022), DOI: 10.1109/IRPS48227.2022.9764542, Dallas, USA, pp. 2C.1-1, March 2022. (PDF, IEEExplore)

  • C. Sohrmann, R. Fischbach, A. Krinke, T. Nirmaier, V. Meyer zu Bexten, G. Jerke, J. Novacek: Towards a Standardized Format for Automotive Mission Profiles. GMM-Fachbericht 99: Automotive meets Electronics (AmE 2021), VDE Verlag, ISBN: 978-3-8007-5487-8, Online-Event, pp. 39-44, March 2021. (PDF, IEEExplore)

  • T. Horst, R. Fischbach, J. Lienig: A Globally-optimized Co-design Approach for Heterogeneous Systems Using Convex Optimization. Proc. of ECCTD 2020, Sofia, Bulgaria, Sept. 2020. (PDF, IEEExplore)

  • R. Fischbach, T. Horst, J. Lienig: A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems. Proc. of 3DIC 2019, Sendai, Oct. 2019. (PDF, IEEExplore)

  • R. Fischbach, T. Horst, J. Lienig: Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. Proc. of DATE 2019, Florence, pp. 950-953, March 2019. (PDF, IEEExplore)

  • T. Horst, R. Fischbach, J. Lienig: Design Methodologies and Co-Design Options for Novel 3D Technologies . Proc. of ANALOG 2018, Munich, pp. 181-186, Sept. 2018. (PDF, IEEExplore)

  • R. Fischbach, A. Heinig, J. Lienig: Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT. GMM-Fachbericht 274, Reliability by Design Proc. (ZuE 2017), VDE Verlag, ISBN 978-3-8007-4444-2, pp. 66-73, Sept. 2017. (PDF, IEEExplore)

  • A. Heinig, M. Chaudhary, R. Fischbach, M. Dittrich: Design Challenges in Interposer-Based 3-D Memory Logic Interface. Advancing Microelectronics, Vol. 43(2), pp. 18-21, 2016.

  • A. Heinig, D. Papaioannou, R. Fischbach: Model Abstraction of 3D-Integrated/Interposer-Based High Performance Systems for Faster (Thermal) Simulation. 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 230-237, 2016

  • A. Heinig, R. Fischbach: Enabling Automatic System Design Optimization Through Assembly Design Kits. International 3D Systems Integration Conference (3DiC), pp. TS8.31.1-TS8.31.5, 2015

  • A. Heinig, R. Fischbach: Overview of 3D CAD Design Tools. Todri-Sanial, A. & Tan, C.S. (ed), Physical Design for 3D Integrated Circuits, CRC Press, pp. 311-320, 2015

  • A. Heinig, D. Papaioannou, R. Fischbach: : Thermal Considerations for Systems with High Speed Memories. European Microelectronics Packaging Conference (EMPC), pp. 1-9, 2015

  • A. Heinig, R. Fischbach: : Thermische Analyse und Optimierung von Wide I/O-Speicher integrierenden 2.5- und 3-D Systemaufbauten. Tagungsband Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS), Fraunhofer Verlag, 2014

  • A. Heinig, R. Fischbach, M. Dittrich: : Interposer Based Wide IO Processor Integration. International Wafer-Level Packaging Conference (IWLPC), 2014

  • A. Heinig, R. Fischbach, M. Dittrich: Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory. Fourteenth Intersociety Conference on Thermal an Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 86-91, 2014

  • R. Fischbach, A. Heinig, P. Schneider: Design rule check and layout versus schematic for 3D integration and advanced packaging. International 3D Systems Integration Conferene (3DIC), pp. 1-7, 2014

  • R. Fischbach, M. Dittrich, A. Heinig: Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache. International Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, MBMV 2014, Böblingen, Germany, pp. 118-192, 2014

  • R. Fischbach, J. Knechtel, J. Lienig: Utilizing 2D and 3D Rectilinear Blocks für Efficient IP Reuse and Floorplanning of 3D integrated Systems. Proceedings of the 2013 ACM International Symposium on Physical Design, pp. 11-16, 2013

  • R. Fischbach: 3D Data Structures for Nanoscale Design. Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging; Gerlach, g. & Wolter, K.-J. (ed.), Springer Verlag Berlin Heidelberg, pp. 97-118, 2012

  • R. Fischbach, J. Lienig, J. Knechtel: Investigating Modern Layout Representations for Improved 3D Design Automation. Proc. of the Great Lakes Symp. on VLSI (GLSVLSI), Lausanne, Switzerland, pp. 337-342, May 2011. (PDF)

  • R. Fischbach, J. Lienig, T. Meister: 3D Physical Design: Challenges and Solutions. Tagungsband edaWorkshop 11, VDE Verlag, ISBN 978-3-8007-3353-8, pp. 39-44, May 2011. (PDF)

  • R. Fischbach, J. Lienig, M. Thiele: Solution Space Investigation and Comparison of Modern Data Structures for Heterogeneous 3D Designs. Proc. of 2nd IEEE Int. 3D System Integration Conf. (3DIC), Munich, Nov. 16-18, 2010.

  • P. Schneider, A. Heinig, R. Fischbach, J. Lienig, S. Reitz, J. Stolle, A. Wilde: Integration of Multi Physics Modeling of 3D Stacks into Modern 3D Data Structures. Proc. of 2nd IEEE Int. 3D System Integration Conf. (3DIC), Munich, Nov. 16-18, 2010.

  • R. Fischbach, J. Lienig, T. Meister: Herausforderungen bei der Automatisierung des Layoutentwurfs bei dreidimensionalen heterogenen Systemen. Tagungsband Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS 2010), Fraunhofer Verlag, ISBN 978-3-8396-0126-6, pp. 37-42, May 2010.

  • R. Fischbach, J. Lienig, J. Hertwig: Modern 3D Data Structures: Classification, Comparison and Solution Space Investigation. Tagungsband edaWorkshop 10, VDE Verlag, ISBN 978-3-8007-3252-4, pp. 41-46, May 2010.

  • R. Fischbach, J. Lienig, T. Meister: From 3D Circuit Technologies and Data Structures to Interconnect Prediction. Invited Talk, Proc. of 2009 Int. Workshop on System Level Interconnect Prediction (SLIP), San Francisco, CA, pp. 77-84, July 2009. (PDF)

  • R. Fischbach, J. Lienig: 3D-Integration und 3D-Datenstrukturen - Eine Übersicht. Tagungsband edaWorkshop 09, VDE Verlag, ISBN 978-3-8007-3165-7, pp. 7-12, May 26-28, 2009. (PDF)

  • R. Fischbach, J. Lienig: 3D Technologies and Data Structures - An Overview. Workshop on 3D Integration, Electronic Workshop Digest, pp. 233-235. Design, Automation and Test in Europe (DATE), Nice, April 2009.

Kontakt:

 

Telefon

+49 351 463 3 5208

Telefax

+49 351 463 3 71 83

E-Mail

robert.fischbachtu-dresden.de
ORCID https://orcid.org/0000-0001-6233-3204

Postanschrift

TU Dresden

 

Institut für Feinwerktechnik und Elektronik-Design

 

D-01062 Dresden

Besucheradresse

Barkhausenbau

 

Helmholtzstraße 18

 

Zimmer II/30

 

 Impressum

Letzte Änderung: 29.03.2022