Dresden University of Technology

Dipl.-Ing. Susann Rothe
Scientific Assistant

Research

• Methods for simulation and mitigation of migration processes in integrated circuits

Publications

• J. Lienig, S. Rothe, M. Thiele: "Fundamentals of Electromigration-Aware Integrated Circuit Design," (2nd edition) [Book's web page, Springer] Springer Cham, ISBN 978-3-031-80022-1, 2025.

• S. Rothe, J. Lienig, S. S. Sapatnekar: “Stress-based Electromigration Modeling in IC Design: Moving from Theory to Practice,” [pdf, IEEEXplore] in Proc. of the Int. Conf. on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD 2024), Volos, Greece, July 2024.

• S. Rothe, J. Lienig: “Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines,” [pdf, DOI] in Proc. of the ACM 2023 Int. Symposium on Physical Design (ISPD'23), Online, March 2023.

• S. Rothe, J. Lienig: “Reliability by Design: Avoiding Migration-Induced Failure in IC Interconnects,” [pdf, IEEEXplore] in Proc. Symposium on Integrated Circuits and Systems Design (SBCCI), August 2022, Brasil.

• J. Lienig, S. Rothe, M. Thiele, N. Rangarajan, M. Nabeel, H. Amrouch, O. Sinanoglu, and J. Knechtel: “Toward security closure in the face of reliability effects,” [pdf, IEEEXplore] in Proc. IEEE/ACM Int. Conf. Comput.-Aided Des. (ICCAD), Special Session, 2021.

• Diploma Thesis, TU Dresden
  Development of a Routing Library for Electromigration-Robust Layout Design,
  Sept. 2021

• Student Research Project, TU Dresden
  Conceptional Design of a Tool for Automatic Translation of Design Rule Formats,
  Aug. 2020

Presentations

• "Anwendung physikalischer Modelle für Elektromigration im IC-Design," [slides] Layout-Fachgruppentreffen,  September 2024, Hannover (German)

• “Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines,” [slides] 17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (IRSP), April 2023, Bad Schandau

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