Dresden University of Technology |
|||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||
S. Osmolovskyi, J. Lienig, "Physical Design Challenges and Solutions for Interposer-Based 3D Systems," GMM-Fachbericht 274, in Reliability by Design Conf. (ZuE 2017), VDE Verlag, pp. 97-104, Sept. 2017 (PDF) J. Knechtel, J. Lienig, S. Osmolovskyi, "3D-Floorplanning für hochparallele Verbindungsstrukturen", in Tagungsband Dresdner Arbeitstagung Schaltungs- und Systementwurf, pp. 16-20, 2014 R. Schwerz, M. Roellig, S. Osmolovskyi, K.-J. Wolter, "Reliability assessment of discrete passive components embedded into PCB core", in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1–7, 2014 S. Osmolovskyi, R. Schwerz, K.-J. Wolter, "Parameters of the manufacturing process and reliability of embedded components", in 36th International Spring Seminar on Electronics Technology (ISSE), pp. 64–69, 2013
|
|||||||||||||||||||||||||||
Last update: 14 October, 2014 |