Fundamentals of Electromigration-Aware Integrated Circuit Design
Jens Lienig, Matthias Thiele
2018, 159 pages, Springer International Publishing
 

ISBN 978-3-319-73557-3,  eBook ISBN 978-3-319-73558-0
DOI 10.1007/978-3-319-73558-0
 

Errata

Please email jens.lienig [at] ifte.de if you find any errors.

Following the convention that compressive stress is defined as negative and tensile stress as positive, the following changes are required:

• p. 35 (last paragraph) and p. 37 (first paragraph of 2.5.2): "negative mechanical tension gradient" should be replaced by "positive mechanical tension gradient".

• Eq. 2.17 on p. 42: the "negative sign" of the right side term should be omitted as follows:
  
  

• p. 105 (segment definition): Please note that (contrary to our definition of a segment here and in Fig. 4.5) the short-length effect (a.k.a. Blech product (jL)) is only applicable to segments which are bordered by diffusion barriers at both ends. There must not be any connected segments within the same metal layer as they would add to the total hydrostatic stress and, thus, impact the EM assessment.

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